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Low Thermal Conductivity Material withstanding high pressure and high temp.

OUR NEEDS AND CHALLENGES

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Date of expiration : 28 May 2015
Status : Closed
Tags: 
Material
low thermal Conductivity
high pressure
high temperature
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Low Thermal Conductivity Material withstanding high pressure and high temp.

Low Thermal Conductivity Material withstanding high pressure and high temp.


We are seeking a material already available on the market, with the following features:

* Elevated temperature

* Support high pressure 

* Thinner is preferred

* Maximum thermal conductivity of 10 W/mK

None

 

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We are seeking a material already available on the market:

* That must be maintained at elevated temperature (withstanding at least 1400-1500 degrees F (760-815 C) for several hours.)

* Able to support high pressure applied in a unique direction (vertical: Z axis of the material). Mininum compressive yield  strength of 25,000 psi (172.36 Mpa is required (higher is better),

Thinner is preferred but thickness of several cm may also be suitable

* With a maximum thermal conductivity of 10 W/mK (lower is better; we want a thermally insulating material 

Possible Approaches :

- Ceramic

- Material treatment

- Disruptive technology

 

The material must not be deformed (not physically destroyed) when exposed to described pressure and temperature level.

Mininum compressive yield  strength of 25,000 psi (172,4 Mpa)

 

We will review submitted proposals and select multiple candidates for detailed investigation. We will execute a Non Disclosure Agreement (NDA) only with selected submitters, seek further information disclosure, and discuss specific development targets or potential opportunities.

We will then select the best candidate through evaluation of supporting information, samples, prototypes, face to face meetings, etc.

The details for any collaboration will be determined through consultation and negotiation.                 

 

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